Joint Strength Comparison Experiment Service
Are there any issues with the bonding strength of wire bonds, die bonds, and materials?
We will conduct a comparative measurement of the bonding strength at the junctions of wire bonds, die bonds, and materials. This is effective for addressing variations in bonding strength that may arise as a result of material development, element development, and substrate development. It is possible to evaluate issues related to the bonding strength of wire bonds, such as reliability and problems after heat treatment. We will compare the bonding strength itself in the state of the materials and assess the quality of strength among multiple samples. It is also possible to evaluate the effects of heat treatment. We also offer services to evaluate cases where the strength varies at the bonding surface. This can be utilized for material testing evaluations during mass production development. When the structure, material structure, or molecular structure between materials can be determined, it is possible to measure the bonding strength of the materials themselves. 【Examples】 - Comparative experiments on bonding strength when variations occur during the development of materials, elements, and substrates. - Evaluation when issues with bonding strength are found after heat treatment. - Comparative experiments on bonding strength to conduct multiple material testing evaluations during mass production development. - Measurement of the strength of the resin itself that has been bonded. *For more details, please refer to the PDF document or feel free to contact us.
- Company：佐用精機製作所
- Price：Other
